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US 9,038,998 B2Granted
Support structures and clamping systems for semiconductor devices during wire and ribbon bonding operations
AssigneeOrthodyne Electronics Corporation
InventorJonathan Michael Byars
Life of this patent
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Abstract
A support structure for supporting a semiconductor device during a bonding operation is provided. The support structure comprises a body portion defining an upper surface configured to support a semiconductor device during a bonding operation. The upper surface defines a constraining feature for constraining at least a portion of the semiconductor device during the bonding operation.
Claims19
A support structure for supporting a semiconductor device during a bonding operation, the support structure comprising:
- a body portion, the body portion defining an upper surface configured to support a semiconductor device during a bonding operation, the upper surface defining a constraining feature for constraining at least a portion of the semiconductor device during the bonding operation,
- wherein the constraining feature includes a raised portion raised above the upper surface to constrain the portion of the semiconductor device during the bonding operation.
Dependencies are inferred from the claim text.