Electronic device, manufacturing method thereof, and electronic apparatus
AssigneeSeiko Epson Corporation
InventorTeruo Takizawa
Life of this patent
Estimating the term…
Abstract
An electronic device includes a base body, a functional element that is placed on the base body, and a lid body, formed from silicon, that is placed over the base body so as to cover the functional element. A hole portion and a sealing member that closes the hole portion are disposed in the lid body, in the hole portion, the area of a second opening disposed on a side opposite to a first opening is larger than the area of the first opening disposed on the base body side, and the ratio of the volume of the sealing member to the volume of the hole portion is equal to or higher than 35% and is equal to or lower than 87%.
Claims16
An electronic device comprising:
- a base body;
- a functional element that is placed on the base body;
- a lid body, formed from silicon, that is placed over the base body so as to cover the functional element;
- and
- a cavity that houses the functional element, wherein the cavity is surrounded by the base body and the lid body,
- wherein a hole portion and a sealing member that closes the hole portion are disposed in the lid body,
- wherein, in the hole portion, the area of a second opening disposed on a side opposite to a first opening is larger than the area of the first opening disposed on the base body side, and
- wherein a ratio of a volume of the sealing member to a volume of the hole portion is equal to or higher than 35% and is equal to or lower than 87%,
- wherein the hole portion includes a bottom face and communicates with the cavity through a communication hole that is disposed in a part of the bottom face, and
- wherein, when an opening area of the second opening of the hole portion is S1, an opening area of the first opening of the communication hole is S2, an opening area of the communication hole on the cavity side is S3, and the area of the bottom face of the hole portion is S4, relation of “S2<S3<S4<S1” is satisfied;
- wherein the bottom face of the hole portion is flat.
A method of manufacturing an electronic device, the method comprising:
- placing a functional element on a base body;
- forming a hole portion in a lid body that is formed from silicon;
- housing the functional element by placing the lid body on the base body;
- arranging a sealing member in the hole portion;
- and
- closing the hole portion by melting the sealing member with energy beams,
- wherein, the hole portion is formed such that the area of a second opening disposed on a side opposite to a first opening is larger than the area of the first opening disposed on the base body side,
- wherein a ratio of a volume of the sealing member to a volume of the hole portion is equal to or higher than 35% and is equal to or lower than 87%,
- wherein a cavity houses the functional element, wherein the cavity is surrounded by the base body and the lid body, wherein the hole portion is a flat bottom face and communicates with the cavity through a communication hole that is disposed in a part of the flat bottom face;
- and
- wherein, when an opening area of the second opening of the hole portion is S1, an opening area of the first opening of the communication hole is S2, an opening area of the communication hole on the cavity side is S3, and the area of the flat bottom face of the hole portion is S4, relation of “S2 <S3 <S4 <S1” is satisfied.
Dependencies are inferred from the claim text.