Thickness shear mode resonator sensors and methods of forming a plurality of resonator sensors

A method of forming a plurality of resonator sensors, comprising:

• forming a plurality of active wafer locations in a unitary structure;
• coupling a plurality of first end cap structures to a first side of the unitary structure;
• coupling a plurality of second end cap structures to a second, opposing side of the unitary structure;
• and
• separating the plurality of active wafer locations laterally between the end cap structures to form a plurality of discrete resonator sensors.

A method of forming a plurality of resonator sensors, comprising:

• forming a plurality of active wafer locations in a first sheet of material comprising:
• locating a central portion of each active wafer of the plurality of active wafer locations;
• bounding the plurality of active wafer locations about the central portions thereof to form a first cavity on a first side of each central portion and a second cavity on a second side of each central portion to form an array of resonator sensors;
• and
• separating the array of resonator sensors to form a plurality of discrete resonator sensors.