Back to results
US 9,006,912 B2Granted
Printed circuit board with coextensive electrical connectors and contact pad areas
AssigneeSanDisk Technologies LLC
InventorsChih-Chin Liao, Han-Shiao Chen, Chin-Tien Chiu, Ken Jian Ming Wang, Cheemen Yu, Hem Takiar
Life of this patent
Estimating the term…
Abstract
A printed circuit board is disclosed having coextensive electrical connectors and contact pad areas. Areas of the contact pads where the traces and/or vias are located may be etched away to ensure electrical isolation between the traces, vias and contact pads.
Claims14
A semiconductor package, comprising:
- a printed circuit board including a conductance pattern on a surface of the printed circuit board;
- an electronic component including an electrical contact mounted to the surface of the printed circuit board for electrically coupling the electronic component to the printed circuit board, the contact having a shape that covers a portion of the printed circuit board;
- a contact pad on the surface of the printed circuit board within the portion of the printed circuit board covered by the contact of the electronic component;
- and
- an electrical connector on the surface of the printed circuit board at least partially within the portion of the printed circuit board covered by the contact of the electronic component, the electrical connector being electrically isolated from the contact pad.
2 more elements
A semiconductor package, comprising:
- a printed circuit board including a conductance pattern on a surface of the printed circuit board;
- an electronic component including an electrical contact mounted to the surface of the printed circuit board;
- a contact pad on the printed circuit board, the contact pad including a void, the electrical contact covering at least a portion of the contact pad;
- and
- an electrical connector on the printed circuit board at least partially within the void and electrically isolated by the void from the contact pad.
2 more elements
Dependencies are inferred from the claim text.