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US 9,006,887 B2Granted
Forming sacrificial composite materials for package-on-package architectures and structures formed thereby
AssigneeIntel Corporation
InventorsRajasekaran Swaminathan, Leonel Arana, Yoshihiro Tomita, Yosuke Kanaoka
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Abstract
Methods of forming a microelectronic packaging structure are described. Those methods may include forming a solder paste comprising a sacrificial polymer on a substrate, curing the solder paste below a reflow temperature of the solder to form a solid composite hybrid bump on the conductive pads, forming a molding compound around the solid composite hybrid bump, and reflowing the hybrid bump, wherein the sacrificial polymer is substantially decomposed.
Claims5
A structure comprising:
- a solder disposed on a conductive pad of a substrate;
- a polymer disposed in contact with a surface of the solder;
- a molding compound disposed on the substrate and spaced apart from the surface of the solder;
- wherein the polymer has a thermal decomposition temperature that is no greater than a reflow temperature of the solder;
- and
- wherein the surface of the solder is separated from the molding compound by the polymer.
3 more elements
Dependencies are inferred from the claim text.