Aggregation of semiconductor devices and the method thereof
AssigneeEpistar Corporation
InventorsHsu-Cheng Lin, Ching-Yi Chiu, Pei-Shan Fang, Chun-Chang Chen
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Abstract
An aggregation of semiconductor devices, comprising: a first layer comprising a first surface and a second surface; a second layer comprising a first region and a second region; and a plurality of semiconductor devices disposed between the first layer and the second region wherein a shape of the second region comprises a curve and a mark.
Claims16
An aggregation of semiconductor devices, comprising:
- a first layer comprising a first surface and a second surface;
- a second layer comprising a first region and a second region;
- and
- a plurality of semiconductor devices disposed between the first layer and the second region wherein a shape of the second region comprises a curve and a mark, wherein the first layer is capable of being expanded to over 2 times of the original area size of the first layer.
An aggregation of semiconductor devices according to 1, further comprises an adhesive glue layer between the first layer and the second layer.
An aggregation of semiconductor devices according to 7, wherein the plurality of semiconductor devices is adhered to the adhesive glue layer.
An aggregation of semiconductor devices according to 7, wherein the first layer is adhered to the second layer by the adhesive glue layer.
Dependencies are inferred from the claim text.