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US 9,006,038 B2Granted
Selective leadframe planishing
AssigneeTexas Instruments Incorporated
InventorDonald C. Abbott
Life of this patent
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Abstract
A method for fabricating a leadframe strip is disclosed. A leadframe pattern is formed from flat sheet of base metal. Additional metal layers are plated on patterned tape of base metal and the leadframe surface is roughed. A first set of leadframe areas is planished. A second set of leadframe areas are offsetted and the tape is cut into strips.
Claims4
A method for fabricating a leadframe strip, said method comprising:
- forming a leadframe pattern from a flat tape of base metal;
- plating a plurality of additional metal layers on the patterned tape of base metal and flood roughening the surface of the metal layers;
- and
- selectively planishing a selected first set of leadframe areas, offsetting a second set of leadframe areas, and cutting tape into strips.
1 more element
Dependencies are inferred from the claim text.