Methods of forming bump and semiconductor device with the same
AssigneeElectronics and Telecommunications Research Institute
InventorsKwang-Seong Choi, Yong Sung Eom, Hyun-cheol Bae, Haksun Lee
Life of this patent
Estimating the term…
Abstract
Provided are methods of forming a bump and a semiconductor device with the same. The method may include providing a substrate with pads, forming a bump maker layer to cover the pads and include a resin and solder particles, thermally treating the bump maker layer to aggregate the solder particles onto the pads, removing the resin to expose the aggregated solder particles, forming a resin layer to cover the aggregated solder particles, and reflowing the aggregated solder particles to form bumps on the pads.
Claims14
A method of forming a semiconductor device, comprising:
- providing a package substrate with pads;
- forming a solder bump maker layer on the package substrate, the solder bump maker layer covering the pads and including a resin and solder particles;
- reflowing the solder particles to form bumps on the pads;
- and
- connecting the bumps to a device substrate to couple the package substrate electrically to the device substrate,
- wherein the reflowing of the solder particles comprises:
- thermally treating the solder bump maker layer to aggregate the solder particles adjacent to the pads onto the pads;
- removing the resin to expose the aggregated solder particles;
- forming a resin layer to cover the solder particles;
- thermally treating the solder particles to form the bumps on the pads;
- and
- removing the resin layer to expose the bumps.
A method of forming a bump, comprising:
- providing a substrate with pads;
- forming a bump maker layer on the substrate to cover the pads and include a resin and solder particles;
- performing a first thermal treatment to the bump maker layer to aggregate the solder particles on the pads;
- removing the resin to expose the aggregated solder particles;
- forming a resin layer to cover the aggregated solder particles;
- and
- performing a second thermal treatment to the bump maker layer to form bumps on the pads.
Dependencies are inferred from the claim text.