Method of manufacturing semiconductor device

A method of manufacturing a semiconductor device, comprising the steps of:

• (a) providing a wiring board having a first main surface over which a plurality of land patterns has been formed;
• (b) mounting a semiconductor chip over the first main surface of the wiring board via an adhesive material;
• (c) curing the adhesive material at a temperature higher than a normal temperature;
• (d) electrically coupling a plurality of pads placed over the surface of the semiconductor chip to a plurality of land pads in the land patterns by using a plurality of metal wires, respectively;
• and
• (e) molding a portion of the wiring board, the semiconductor chip, and the metal wires with a molding body, wherein
• in a planar view, an average distance between local peaks of the surface roughness of a first region between each of the land pads of the wiring board and the semiconductor chip is smaller than an average distance between local peaks of the surface roughness of a second region between each of the land pads of the wiring board and the first region, and
• the height of the surface of the first region is greater than the height of the surface of the second region.