Semiconductor device and method of forming EWLB package with standoff conductive layer over encapsulant bumps

A method of making a semiconductor device, comprising:

• providing a carrier;
• forming a plurality of recesses partially through the carrier;
• forming a first conductive layer over a surface of the carrier and into the recesses;
• mounting a semiconductor die to the carrier;
• depositing an encapsulant over the carrier and semiconductor die, the encapsulant extending into the recesses over the first conductive layer;
• forming a plurality of conductive vias through the encapsulant electrically connected to the first conductive layer;
• removing the carrier to expose the first conductive layer;
• and
• forming a second conductive layer between the first conductive layer and contact pads on the semiconductor die.

A method of making a semiconductor device, comprising:

• providing a semiconductor die;
• depositing an encapsulant over the semiconductor die, the encapsulant including encapsulant bumps offset with respect to a surface of the semiconductor die;
• forming a first insulating layer over the encapsulant bumps and semiconductor die;
• and
• forming a first conductive layer over the first insulating layer over the encapsulant bumps and extending through the first insulating layer to the semiconductor die.

A method of making a semiconductor device, comprising:

• providing a semiconductor die including a contact pad;
• depositing an encapsulant over the semiconductor die to cover the semiconductor die and form encapsulant bumps;
• forming a first insulating layer over the semiconductor die;
• and
• forming a first conductive layer on the encapsulant bumps and extending through the first insulating layer to the contact pad.