Method of detecting bitmap failure associated with physical coordinate

A method of detecting bitmap failure associated with physical coordinates, the method comprising:

• obtaining data of wafer mapping inspection, the data of wafer mapping inspection comprising images of a plurality of defects in each of layers within a wafer and a plurality of physical coordinates of the defects within the wafer;
• performing a bitmap failure detection to obtain digital coordinates of a plurality of failure bits within the wafer;
• converting the digital coordinates into a plurality of physical locations arranged in a line or polygon;
• and
• overlapping the physical locations with the physical coordinates within the wafer so as to obtain correlations between the failure bits and the defects.