Methods for making controlled delivery devices having zero order kinetics

A method for making a device for delivery of one or more active agents with zero-order kinetics by a reactive ion etching technique comprising the steps of:

• providing a silicon-wafer mold comprising a first surface and a second surface, wherein the first surface comprises one or more trenches, cavities or depressions, wherein each of the one or more trenches, cavities or depressions comprise one or more holes, perforations or patterns wherein the silicon-wafer mold forms a non-planer cylindrical enclosure;
• placing a first substrate in the trenches, cavities or depressions, wherein the substrate may optionally be held in place in the trench by using an adhesive, wherein the first substrate comprises a polyimide polymer;
• and
• transferring a shape of the holes, the perforations or the patterns in the one or more trenches, cavities or depressions to the first substrate by using a reactive plasma to make a non-planer enclosure having a series of passageways that connect an outer surface and an inner area for the delivery of the one or more active agents through the series of passageways with a zero order release kinetics.