Cu—Ni—Si alloy for electronic material
AssigneeJX Nippon Mining & Metals Corporation
InventorMitsuhiro Ookubo
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Abstract
The distribution of Ni—Si compound grains is controlled to thereby improve the properties of Corson alloys. The copper alloy for electronic materials comprises 0.4 to 6.0% mass of Ni and 0.1 to 1.4% by mass of Si, with the balance being Cu and unavoidable impurities. The copper alloy comprising: small particles of Ni—Si compound having a particle size of equal to or greater than 0.01 μm and smaller than 0.3 μm; and large particles of Ni—Si compound having a particle size of equal to of greater than 0.3 μm and smaller than 1.5 μm. The number density of the small particles is 1 to 2000 pieces/μm2 and the number density of the large particles is 0.05 to 2 pieces/μm2.
Claims9
A copper alloy for electronic materials comprising 0.4 to 6.0% by mass of Ni and 0.1 to 1.4% by mass of Si, with the balance being Cu and unavoidable impurities, the copper alloy comprising:
- small particles of Ni—Si compound having a particle size of equal to or greater than 0.01 μm and smaller than 0.3 μm;
- and
- large particles of Ni—Si compound having a particle size of equal to or greater than 0.3 μm and smaller than 1.5 μm;
- wherein the number density of the small particles is 1 to 2000 pieces/μm2 and the number density of the large particles is 0.05 to 2 pieces/μm2.
Dependencies are inferred from the claim text.