Method and apparatus for transfer lamination
AssigneeHazen Paper Company
InventorJohn Hazen
Life of this patent
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Abstract
An embodiment of the inventive method of transfer lamination bonding a first metallized side of a film to a substrate. Then a breakaway coating is applied to a second, non-metallized side of the film after the first metallized side has been bonded to the substrate. The bonded film and substrate are then placed in an oven. The film is then stripped from the substrate leaving metal from the film deposited on the substrate. The application of the breakaway coating is performed as an inline part of the transfer lamination process thereby providing an ease of manufacture presently unknown.
Claims21
A method for transfer lamination, said method comprising the steps of:
- bonding a first side of a film having a first breakaway coating and a metallized layer to a substrate;
- applying a second breakaway coating to a second side of said film after it has been bonded to said substrate;
- curing said bonded film and substrate;
- removing said film from said substrate leaving metal from said first side of said film deposited on said substrate;
- and
- wherein said application of said breakaway coating is performed as an inline part of a transfer lamination process.
A method for transfer lamination, said method comprising the steps of:
- bonding a first side of a film having a first breakaway coating and a metallized layer to a substrate;
- applying a second breakaway coating to a second side of said film after it has been bonded to said substrate;
- curing said bonded film and substrate in a first zone of an oven;
- removing said film from said substrate leaving metal from said first side of said film deposited on said substrate;
- coating said metallized substrate after said film has been removed to facilitate printing on said metallized substrate;
- curing said coated, metallized substrate in a second zone of said oven;
- and
- wherein said application of said breakaway coating is performed as an inline part of said transfer lamination process.
A system for transfer lamination of a substrate, said system comprising:
- a bonding station for bonding a first side of a film having a first breakaway coating and a metallized layer to a substrate;
- a first coating station for applying a second breakaway coating to a second side of said film after it has been bonded to said substrate, said first coating station being located downstream from said bonding station;
- a curing station for curing said bonded film and substrate;
- and
- a stripping station for removing said film with said second breakaway coating from said substrate.
A method for transfer lamination, said method comprising the steps of:
- bonding a first side of a film having a first breakaway coating and a metallized layer to a substrate;
- applying a second breakaway coating to a second side of said film after it has been bonded to said substrate;
- curing said bonded film and substrate;
- and
- removing said film from said substrate leaving metal from said first side of said film deposited on said substrate.
Dependencies are inferred from the claim text.