Bonding apparatus, bonding system and bonding method

A bonding system comprising:

• a carry-in/out station configured to place a first substrate and a second substrate;
• a substrate transfer apparatus configured to transfer the first substrate and the second substrate placed in the carry-in/out station;
• and
• a bonding station provided with a bonding apparatus configured to bond the first substrate and the second substrate transferred by the substrate transfer apparatus,
• wherein the bonding apparatus includes:
• a first holding unit provided with a first heating mechanism and configured to hold a first substrate;
• a second holding unit disposed facing the first holding unit, provided with a second heating mechanism and configured to hold a second substrate;
• a pressing mechanism configured to relatively move the first holding unit and the second holding unit in order to contact and press the first substrate and the second substrate;
• a first cooling mechanism provided at an opposite side to a holding surface of the first holding unit and configured to cool the first substrate through the first holding unit;
• a second cooling mechanism provided at an opposite side to a holding surface of the second holding unit and configured to cool the second substrate through the second holding unit;
• a third heating mechanism provided on a surface of the first cooling mechanism opposite to the surface on which the first holding unit is disposed and configured to heat the first cooling mechanism;
• and
• a fourth heating mechanism provided on a surface of the second cooling mechanism opposite to the surface on which the second holding unit is disposed and configured to heat the second cooling mechanism.

A bonding method comprising:

• holding and heating a first substrate by a first holding unit provided with a first heating unit and configured to hold the first substrate;
• holding and heating a second substrate by a second holding unit disposed facing the first holding unit, provided with a second heating mechanism and configured to hold the second substrate;
• contacting and compressing the first substrate and the second substrate by relatively moving the first holding unit and the second holding unit;
• cooling the first substrate by a first cooling mechanism provided at an opposite side to a holding surface of the first holding unit and configured to cool the first substrate through the first holding unit;
• cooling the second substrate by a second cooling mechanism provided at an opposite side to a holding surface of the second holding unit and configured to cool the second substrate through the second holding unit;
• heating the first cooling mechanism by a third heating mechanism provided on a surface of the first cooling mechanism opposite to the surface on which the first holding unit is disposed and configured to heat the first cooling mechanism;
• and
• heating the second cooling mechanism by a fourth heating mechanism provided on a surface of the second cooling mechanism opposite to the surface on which the second holding unit is disposed and configured to heat the second cooling mechanism.