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US 9,005,330 B2Granted
Electrically conductive compositions comprising non-eutectic solder alloys
AssigneeOrmet Circuits, Inc.
InventorsCatherine Shearer, Peter A Matturri, Kenneth C Holcomb, Michael C Matthews
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Abstract
Transient liquid phase sintering compositions comprising one or more high melting point metals and one or more low melting temperature alloys are known in the art as useful compositions for creating electrically and/or thermally conductive pathways in electronic applications. The present invention provides transient liquid phase sintering compositions that employ non-eutectic low melting temperature alloys for improved sintering and metal matrix properties.
Claims35
A transient liquid phase sintering (TLPS) composition comprising:
- a) at least one first particle comprising at least one high-melting-point metal (M);
- and
- b) at least one second particle comprising a low-melting-temperature alloy, wherein the low melting temperature alloy comprises:
- i) a first metallic element (X) that is non-reactive with M;
- ii) a second metallic element (Y) that is reactive with M,
- wherein X and Y are present in a non-eutectic proportion in the low-melting-temperature alloy, and
- wherein the proportion of X in the low-melting temperature alloy is less than 68% by weight of the proportion of X in a eutectic alloy of X and Y;
- and
- c) an organic vehicle.
6 more elements
Dependencies are inferred from the claim text.