Wireless devices including printed integrated circuitry and methods for manufacturing and using the same

A method of manufacturing an identification device, comprising:

• a) forming printed integrated circuitry on a first substrate, the printed integrated circuitry comprising a plurality of electrically active devices, the plurality of electrically active devices including a plurality of thin films, the plurality of thin films comprising a lowest layer in physical contact with a surface of said first substrate, a first successive layer on the lowest layer, and a second successive layer on the first successive layer, wherein the lowest layer and the first and second successive layers taken together comprise an insulating thin film, a metal thin film, and a semiconductor thin film and forming the printed integrated circuit comprises printing at least one of the lowest layer and the first and second successive layers;
• b) forming first and second pads electrically connected to the printed integrated circuitry at first and second locations, respectively;
• c) forming a single-layer antenna and/or inductor consisting essentially of a conductive line having first and second ends on a second substrate;
• and
• d) physically connecting the first and second pads to the first and second ends of the single-layer antenna and/or inductor, respectively.

A method of manufacturing radio frequency identification devices, comprising:

• a) forming a plurality of printed integrated circuits on a first substrate stock to form a printed integrated circuit (PIC) stock, the printed integrated circuit stock comprising a plurality of electrically active devices, the plurality of electrically active devices including a plurality of thin films, the plurality of thin films comprising a lowest layer in physical contact with a surface of said first substrate, a first successive layer on the lowest layer, and a second successive layer on the first successive layer, wherein the lowest layer and the first and second successive layers taken together comprise an insulating thin film, a metal thin film, and a semiconductor thin film, and forming the plurality of printed integrated circuits comprises printing at least one of the lowest layer and the first and second successive layers;
• b) forming a plurality of single-layer antennas and/or inductors on a second substrate stock to form an antenna stock, each of the plurality of single-layer antennas and/or inductors having first and second opposed ends;
• and
• c) attaching the PIC stock to the antenna stock, each of the plurality of PICs being physically connected at first and second locations to the first and second ends of a corresponding one of the plurality of single-layer antennas, respectively.