Method for metalizing blind vias

A method for metalizing at least one blind via formed in at least one substrate, comprising:

• a) covering at least a part of walls of the at least one blind via with a material that prevents wetting of said part of the walls, the material being a fluorinated material or a polymeric material,
• b) arranging at least one solid portion of electrically conductive material in the at least one blind via,
• c) performing a thermal treatment of the solid portion of electrically conductive material, making the electrically conductive material melt in the at least one blind via, and
• d) cooling the electrically conductive material, solidifying the electrically conductive material in the at least one blind via,
• wherein carrying out step a) prevents wetting of said part of the walls of the at least one blind via by the melted electrically conductive material obtained during the performance of step c), the solidified electrically conductive material obtained after carrying out step d) being isolated from said part of the walls of the at least one blind via, wherein the solidified electrically conductive material is mechanically decoupled from the at least one substrate.