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AssigneeDelta Electronics (Shanghai) Co., Ltd.
InventorsLifeng Pan, Hongming Li
Estimating the term…
A semiconductor switch insulation protection device and a power supply assembly. Said semiconductor switch protection device comprises a semiconductor switch having a metal component, an insulation component, and a pin installed at a bottom plane of said insulation component, and an insulation protection cover having a body with a second hole and a side belt. A front surface of said metal component is installed on a back surface of said insulation component. A metal portion, with a first hole and having a first height, is extended above an upper plane of said insulation component. Said second hole and said side belt are extended toward a back surface of said body, respectively, to form a hole column having a second height and a sidewall having a third height. Said metal portion is disposed in a groove formed by said back surface of said body, hole column and sidewall.
A semiconductor switch insulation protection device, comprising a semiconductor switch, said semiconductor switch comprises a metal component, an insulation component, and a pin, a front surface of said metal component is installed on a back surface of said insulation component, and a metal portion having a first height is extended above an upper plane of said insulation component, said metal portion comprises a first hole, said pin is installed at a bottom plane of said insulation component, wherein the semiconductor switch insulation protection device further comprises an insulation protection cover, said insulation protection cover comprises a body, said body comprises a second hole and a side belt, said second hole is extended toward a back surface of said body to form a hole column having a second height, said side belt is extended toward the back surface of said body to form a sidewall having a third height, a groove is formed by the back surface of said body, said hole column and said sidewall, and the metal portion having the first height is disposed in said groove, wherein said second height of said hole column is larger than a thickness of said metal component.
A power supply assembly, comprising a heat sink device, a semiconductor switch, said semiconductor switch comprises a metal component, an insulation component, and a pin, a front surface of said metal component is installed on a back surface of said insulation component, and said metal component is extended above an upper plane of said insulation component to form a metal portion having a first height, said metal portion comprises a first hole, said pin is installed on a bottom plane of said insulation component, wherein the power supply assembly further comprises an insulation protection cover, said insulation protection cover comprises a body, said body comprises a second hole and a side belt, said second hole is extended toward a back surface of said body to form a hole column having a second height, said side belt is extended toward the back surface of said body to form a sidewall having a third height, a groove is formed by the back surface of said body, said hole column and said sidewall, and the metal portion having the first height is disposed in said groove, said insulation protection cover and said semiconductor switch are installed on said heat sink device by a fastener, wherein said second height of said hole column is larger than a thickness of said metal component.
Dependencies are inferred from the claim text.