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US 9,000,559 B2Granted
Semiconductor device, method of cutting electrical fuse, and method of determining electrical fuse state
AssigneeRenesas Electronics Corporation
InventorTakehiro Ueda
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes a semiconductor substrate and an electrical fuse formed on the semiconductor substrate, and including a first conductor and a second conductor electrically separated from the first conductor. In a state of the electrical fuse after a cutting processing, the first conductor is cut and separated into a first part electrically separated from the second conductor and a second part including a flowing region from which a material constituting the first conductor flows outward and which is electrically connected to the second conductor.
Claims26
A semiconductor device, comprising:
- a semiconductor substrate;
- and
- a plurality of electrical fuses formed on said semiconductor substrate, each electrical fuse including a first terminal, a second terminal, a third terminal, a first conductor and a second conductor,
- wherein the first conductor connects the first terminal to the second terminal, and is electrically separated from the third terminal,
- the first conductor is configured to be split into a first part extending from the first terminal and a second part extending from the second terminal which are electrically separated from each other, and the second conductor extends from the second part and is electrically connected to the third terminal, said second conductor including an interconnect electrically connected to the third terminal and formed on a same layer as the first conductor, and
- a plurality of the first terminals of the electrical fuses are electrically connected to each other.
3 more elements
A semiconductor device, comprising:
- a semiconductor substrate;
- and
- a plurality of electrical fuses formed on said semiconductor substrate, each electrical fuse including a first terminal, a second terminal, a third terminal, a first conductor and a second conductor,
- wherein the first conductor connects the first terminal to the second terminal, and is electrically separated from the third terminal,
- the first conductor is configured to be split into a first part extending from the first terminal and a second part extending from the second terminal which are electrically separated from each other, and the second conductor extends from the second part and is electrically connected to the third terminal, and
- a plurality of the first terminals of the electrical fuses are electrically connected to each other,
- wherein the first and second terminals are formed on different layers, and the first conductor includes a first interconnect formed on the same layer as the second terminal, a second interconnect formed on the same layer as that upon which the first terminal is formed, and a via electrically interconnecting the first and second interconnects.
4 more elements
A semiconductor device, comprising:
- a plurality of electrical fuses formed on a semiconductor substrate;
- wherein the electrical fuses includes at least an electrical fuse which is configured to be cut, and at least a dummy electrical fuse which is not configured to be cut, and
- the dummy electrical fuse which is not separable includes a first terminal, a second terminal, a third terminal, a first conductor connecting the first terminal and the second terminal, and a second conductor extending from the third terminal and electrically separated from the first terminal and the second terminal, and
- the electrical fuse which is separable includes a fourth terminal, a fifth terminal, a sixth terminal, a first part of a third conductor extending from the fourth terminal, a second part of the third conductor extending from the fifth terminal and configured to be separated from the first part of the third conductor by cutting the electrical fuse, and a fourth conductor extending from the sixth terminal and electrically connected to the second part of the third conductor and electrically separated from the first part of the third conductor,
- wherein a plurality of the first terminal and a plulrality of the fourth terminals of the electrical fuses are electrically connected to each other.
2 more elements
A semiconductor device, comprising:
- a semiconductor substrate;
- and
- an electrical fuse formed on said semiconductor substrate, and including a first terminal, a second terminal, a third terminal, a first conductor connecting said first terminal to said second terminal, and a second conductor extending from said third terminal;
- wherein said second conductor is not connected to both said first terminal and said second terminal,
- said first conductor includes a first part extending from said first terminal and a second part extending from said second terminal,
- said first part is connected to said second part,
- said second part includes a bent structure having a plurality of parallel linear portions, and
- said second part is located closer to said second conductor than said first part.
5 more elements
Dependencies are inferred from the claim text.