Evaporation source assembly, film deposition device and film deposition method

A film deposition device, which comprises a vacuum chamber and an evaporation source assembly provided in the vacuum chamber, wherein the evaporation source assembly is used to deposit a film on a substrate, the evaporation source assembly comprises:

• a body which comprises a top element, a bottom element and side walls which define a hollow chamber together, the bottom element comprising a plurality of inlet openings communicating with the chamber;
• a plurality of nozzles which are located at the top element and communicate with the chamber;
• a plurality of evaporators for containing and evaporating the evaporating material, each of which being positioned below the body and corresponding to one of the inlet openings respectively, and having an opening through which the evaporator communicates with the corresponding inlet opening;
• and
• a plurality of connecting pipes configured to connect the opening of the evaporators with the inlet openings of the body, the connecting pipes being tapered pipes with a broad top and a narrow bottom so as to improve the vapor pressure of the evaporating material in the body to reach pressure balance.