Capacitive sensing button on chip
AssigneeCypress Semiconductor Corporation
InventorsRajagopal Narayanasamy, Mahadevan Krishnamurthy Narayana Swamy, David Wright, Steven Kolokowsky
Life of this patent
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Abstract
An embodiment of an integrated circuit device may comprise an integrated circuit package, a sensor element attached within the integrated circuit package, a capacitance sensor coupled with the sensor element and situated within the integrated circuit package, wherein the capacitance sensor is configured to measure a capacitance of the sensor element, and an output pin positioned at the exterior of the integrated circuit package, wherein the output pin is configured to carry a signal based on the measured capacitance of the sensor element.
Claims21
An integrated circuit device, comprising:
- an integrated circuit package;
- a sensor element attached within the integrated circuit package;
- a capacitance sensor coupled with the sensor element and situated within the integrated circuit package, wherein the capacitance sensor is configured to measure a capacitance of the sensor element;
- a ground pad attached within the integrated circuit package and coupled with the capacitance sensor;
- and
- an output pin positioned at the exterior of the integrated circuit package, wherein the output pin is configured to carry a signal based on the measured capacitance of the sensor element.
An integrated circuit device, comprising:
- an integrated circuit package;
- a sensor element attached within the integrated circuit package;
- a ground pad attached within the integrated circuit package;
- an output pin positioned at the exterior of the integrated circuit package, wherein the output pin is configured to carry a signal based on the measured capacitance of the sensor element;
- and
- a capacitance sensor coupled with the sensor element and situated within the integrated circuit package, wherein the capacitance sensor is configured to measure a capacitance of the sensor element, and based on the measured capacitance, apply a signal to the output pin.
A method, comprising:
- using a capacitance sensor coupled to a sensor element and a ground pad, detecting proximity of a conductive object near an exterior surface of an integrated circuit package that includes the capacitance sensor, the sensor element and the ground pad;
- and
- signaling the proximity of the conductive object at an output pin at an exterior surface of the package.
Dependencies are inferred from the claim text.