Wafer storing container

A wafer storing container, comprising:

• a container body for storing a plurality of semiconductor wafers in a state of being arranged in a parallel manner;
• a wafer load/unload opening that is formed in a front face of the container body for the purpose of loading or unloading the semiconductor wafer to or from the container body;
• a cover removably attached from a front of the wafer load/unload opening for the purpose of closing the wafer load/unload opening;
• and
• wafer support shelves for individually mounting outer margins of the plurality of semiconductor wafers so as to horizontally support the semiconductor wafers at positions on right and left sides inside the container body as viewed from the wafer load/unload opening, in a state where the cover is not attached to the wafer load/unload opening,
• wherein the outer margins of the plurality of semiconductor wafers are partially mounted on wafer support projections of the wafer support shelves arranged on the right and left sides as viewed from the wafer load/unload opening,
• wherein the wafer support projections are provided at one point on a back side and at two points on a front side in each of the right and left sides, on the basis of a central position of the semiconductor wafers as viewed from the wafer load/unload opening
• wherein, among the front-side wafer support projections provided at two points in each of the right and left sides, second front-side wafer support projections farther from a reference center line are each provided in a direction at an angle within a range of 45±15 degrees relative to the reference center line, which passes through the central position of the semiconductor wafers, and is parallel to the wafer load/unload opening,
• wherein, among the front-side wafer support projections provided at two points in each of the right and left sides on the front side on the basis of the central position of the semiconductor wafers, first front-side wafer support projections closer to the reference center line are each provided in a direction at an angle within a range of 20±5 degrees relative to the reference center line, and
• wherein the first and second front-side wafer support projections have a relative positional relationship with each other at different angles within a range of 10 to 30 degrees around the central position of the semiconductor wafers.