3DIC packages with heat dissipation structures
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsWensen Hung, Szu-Po Huang, Kim Hong Chen, Shin-Puu Jeng
Life of this patent
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Abstract
A package includes a first die and a second die underlying the first die and in a same first die stack as the first die. The second die includes a first portion overlapped by the first die, and a second portion not overlapped by the first die. A first Thermal Interface Material (TIM) is over and contacting a top surface of the first die. A heat dissipating lid has a first bottom surface contacting the first TIM. A second TIM is over and contacting the second portion of the second die. A heat dissipating ring is over and contacting the second TIM.
Claims20
A package comprising:
- a first die;
- a second die underlying the first die and in a same first die stack as the first die, wherein the second die comprises:
- a first portion overlapped by the first die;
- and
- a second portion not overlapped by the first die;
- a first Thermal Interface Material (TIM) over and contacting a top surface of the first die;
- a heat dissipating lid comprising a first bottom surface contacting the first TIM;
- a second TIM over and contacting the second portion of the second die;
- and
- a heat dissipating ring over and contacting the second TIM.
A package comprising:
- a die stack comprising a plurality of dies;
- a die underlying and bonded to the die stack, wherein the die comprises:
- a first portion overlapped by the die stack;
- and
- a second portion not overlapped by the die stack;
- a first Thermal Interface Material (TIM) over and contacting a top surface of the die stack;
- a heat dissipating lid comprising:
- a first portion over and contacting the first TIM;
- and
- a second portion overlapping the second portion of the die;
- a second TIM over and contacting the second portion of the die;
- and
- a heat dissipating ring comprising an extension portion, wherein the extension portion is overlapped by the second portion of the heat dissipating lid, and wherein the extension portion of the heat dissipating ring further comprises a bottom surface contacting the second TIM.
A package comprising:
- a package substrate;
- a die overlying and bonded to the package substrate;
- a die stack comprising a plurality of dies, wherein the die stack is over and bonded to the die;
- a first Thermal Interface Material (TIM) over and contacting a top surface of the die stack;
- a heat dissipating lid over and contacting the first TIM;
- a second TIM over and contacting a top surface of the die;
- a heat dissipating ring encircling the die stack, wherein the heat dissipating ring comprises a first bottom surface contacting the second TIM;
- and
- an adhesive contacting a bottom surface of the heat dissipating lid and a top surface of the heat dissipating ring.
Dependencies are inferred from the claim text.