Microelectronic substrate having removable edge extension element

An article including a microelectronic substrate, comprising:

• a microelectronic substrate having a front surface, a rear surface opposite said front surface and a peripheral edge at boundaries of said front and rear surfaces, said front surface being a major surface;
• a removable annular edge extension element;
• and
• a releasable layer;
• said removable annular edge extension element having a front surface, a rear surface and an inner edge extending between said front and rear surfaces, said inner edge being joined to said peripheral edge of said microelectronic substrate by said releasable layer to form a continuous, co-planar, flat surface extending across said front surface of said edge extension element extending laterally from said releasable layer at the peripheral edge of the microelectronic substrate, said releasable layer and said front surface of said microelectronic substrate, wherein said edge extension element includes a polymer and, wherein said edge extension element has a body portion that contains said front surface that forms a part of the continuous, co-planar, flat surface and includes a dam extending from and beyond said continuous, co-planar, flat surface and away from said body portion, said dam including said polymer.

An article including a semiconductor wafer, comprising:

• a semiconductor wafer having a front surface, a rear surface opposite said front surface and a peripheral edge at boundaries of said front and rear surfaces, said front surface being a major surface;
• a removable annular edge extension element;
• and
• a releasable layer;
• said removable annular edge extension element consisting essentially of at least one material selected from the group consisting of a polymer settable by heat and a polymer settable by light, said edge extension element having a front surface, a rear surface and an inner edge extending between said front and rear surfaces, said inner edge being joined to said peripheral edge of said semiconductor wafer by said releasable layer to form a continuous, co-planar, flat surface extending across said front surface of said edge extension element extending laterally from said releasable layer at the peripheral edge of the microelectronic substrate, said releasable layer and said front surface of said semiconductor wafer, said front surface of said edge extension element extending laterally between about 0.25 cm and about 2.5 cm beyond said peripheral edge.