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US 8,946,857 B2Granted
Semiconductor device for effectively disperse heat generated from heat generating device
AssigneesFujitsu Limited, Fujitsu Semiconductor Limited
InventorsMitsuaki Igeta, Takashi Suzuki
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Abstract
A semiconductor device includes a semiconductor substrate, a heat generating device, and a heat radiating part. The heat generating device is provided on the semiconductor substrate, and the heat radiating part is provided above the heat generating device. The heat radiating part is thermally coupled with the semiconductor substrate through at least one contact part.
Claims9
A semiconductor device comprising:
- a semiconductor substrate;
- a heat generating device provided on the semiconductor substrate;
- a heat radiating part provided above the heat generating device;
- and
- an interconnect provided above the heat radiating part, wherein
- the heat radiating part is thermally coupled with the semiconductor substrate through at least one contact part, and
- an entire region overlapping with the interconnect in the heat generating device, in planar view, is entirely covered by the heat radiating part.
4 more elements
Dependencies are inferred from the claim text.