Transistor including an oxide semiconductor and display device using the same
AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorsMasashi Tsubuku, Kosei Noda
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AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorsMasashi Tsubuku, Kosei Noda
Estimating the term…
The band tail state and defects in the band gap are reduced as much as possible, whereby optical absorption of energy which is in the vicinity of the band gap or less than or equal to the band gap is reduced. In that case, not by merely optimizing conditions of manufacturing an oxide semiconductor film, but by making an oxide semiconductor to be a substantially intrinsic semiconductor or extremely close to an intrinsic semiconductor, defects on which irradiation light acts are reduced and the effect of light irradiation is reduced essentially. That is, even in the case where light with a wavelength of 350 nm is delivered at 1×1013 photons/cm2·sec, a channel region of a transistor is formed using an oxide semiconductor, in which the absolute value of the amount of the variation in the threshold voltage is less than or equal to 0.65 V.
A semiconductor device comprising:
A semiconductor device comprising:
A semiconductor device comprising:
A semiconductor device comprising:
A semiconductor device comprising:
Dependencies are inferred from the claim text.
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The present invention relates to a semiconductor element such as a transistor and/or a display device at least part of which is formed using a semiconductor element. For example, an active element formed including an oxide semiconductor as a semiconductor element is illustrated, and a display device using the active element is illustrated.
Although transistors formed using amorphous silicon had been used for conventional display devices typified by liquid crystal televisions, an oxide semiconductor has attracted attention as a material which replaces a silicon semiconductor in order to form transistors. For example, an active matrix display device, in which an amorphous oxide including In, Ga, and Zn is used for an active layer of a transistor and the electron carrier concentration of the amorphous oxide is lower than 1018/cm3, is disclosed (see Patent Document 1).
However, some problems of a transistor formed using an oxide semiconductor have been pointed out. One of these is stability of characteristics, and it is pointed out that threshold voltage is changed by irradiation with visible light and ultraviolet light (e.g., see Non-Patent Document 1). Further, a problem, in which characteristics are changed by a bias-temperature stress test in terms of reliability of a transistor, has been pointed out (e.g., see Non-Patent Document 2).
FIG. 1 is a cross-sectional view illustrating one embodiment of a semiconductor device.
FIGS. 2A and 2B are graphs each showing evaluation results of electrical characteristic of a transistor of sample 1.
FIGS. 3A and 3B are graphs each showing evaluation results of electrical characteristics of a transistor of sample 2.
Embodiments of the present invention disclosed are described below with reference to the drawings. However, the present invention is not limited to the following description, and it is easily understood by those skilled in the art that modes and details can be changed in various ways without departing from the spirit and scope of the present invention. Therefore, the present invention is not interpreted as being limited to the description of the embodiments below.
Further, in the embodiments hereinafter described, the same parts are denoted with the same reference numerals throughout the drawings. Note that components illustrated in the drawings, that is, a thickness or a width of a layer, a region, or the like, a relative position, and the like are exaggerated in some cases for clarification in description of embodiments.
The structure of a transistor according to one embodiment of the present invention will be described with reference to FIG. 1, FIGS. 2A and 2B, FIGS. 3A and 3B, FIGS. 4A and 4B, FIGS. 5A and 5B, and FIG. 6.