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US 8,946,087 B2Granted
Electroless copper deposition
AssigneeLam Research Corporation
InventorPraveen Reddy Nalla
Life of this patent
Estimating the term…
Abstract
A method for providing metal filled features in a layer is provided. A metal seed layer is deposited on tops and bottoms of the features. Metal seed layer on tops of the features and overhangs is removed without removing metal seed layer on bottoms of features. An electroless deposition of metal is provided to fill the features, wherein the electroless deposition first deposits on the metal seed layer on bottoms of the features.
Claims18
A method for providing metal filled features in a layer comprising:
- depositing a metal seed layer on tops and bottoms of the features;
- removing the metal seed layer on tops of the features and overhangs and on at least part of the sidewalls within the features without removing any of the metal seed layer on bottoms of features;
- and
- providing an electroless deposition of metal to fill the features, wherein the
- electroless deposition first deposits on the metal seed layer on bottoms of the features,
- wherein the depositing the metal seed layer deposits the metal seed layer on bottoms of the features with respect to sidewalls of the features at a thickness ratio of at least 10:1.
3 more elements
A method for providing copper or copper alloy filled features in a layer comprising:
- depositing a barrier layer in the features;
- directionally and selectively depositing a copper or copper alloy seed layer on tops and bottoms of the features with respect to sidewalls of the features;
- selectively removing the copper or copper alloy seed layer on tops of the features and overhangs and on at least part of the sidewalls within the features without removing any of the copper or copper alloy seed layer on bottoms of features using a wet etch or chemical mechanical polishing;
- and
- providing an electroless copper or copper alloy deposition to fill the features, wherein the electroless copper or copper alloy deposition first deposits on the copper or copper alloy seed layer on bottoms of the features.
2 more elements
Dependencies are inferred from the claim text.