Metrology test structures in test dies
AssigneeInternational Business Machines Corporation
InventorAnthony K. Stamper
Life of this patent
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Abstract
Test dies having metrology test structures and methods of manufacture are disclosed. The method includes forming one or more metrology test structures in a test die that are identical to one or more structures formed in an adjacent product chip.
Claims19
A method comprising forming one or more metrology test structures in a test die that are identical or nearly identical to one or more structures formed in an adjacent product chip, wherein the forming of the one or more metrology test structures is formed remotely from an edge area of the test die and the edge area is about 50 μm in width.
A method comprising forming test structures in a test die, adjacent to product chips, the test structures and structures on the product chips are formed substantially identically, using same processing steps and materials, wherein the test structures and the structures are MEMS structures with identical or nearly identical cavity structures.
A method comprising forming test structures in a test die, adjacent to product chips, the test structures and structures on the product chips are formed substantially identically, using same processing steps and materials, wherein:
- the test structures and structures are formed outside of a dicing channel;
- and
- the test structures and structures are formed with identical or substantially identical cavity structures.
Dependencies are inferred from the claim text.