Back to results
US 8,940,587 B1Granted
Die seal design and method and apparatus for integrated circuit production
AssigneeAmkor Technology, Inc.
InventorBora Baloglu
Life of this patent
Estimating the term…
Abstract
Novel die seals control contact of a mold material with the surfaces of a semiconductor die during encapsulation, reducing stresses due to a mismatch of the coefficient of thermal expansion of the encapsulant and the semiconductor die, thereby reducing cracking of the semiconductor die, resulting in increased yields and lower costs.
Claims23
A method for producing an electrical circuit, the method comprising:
- placing a semiconductor die in a mold tool, the semiconductor die comprising a first die surface, a second die surface generally parallel to the first die surface, and a plurality of die faces, each die face connecting an edge of the first die surface with a corresponding edge of the second die surface to define a die thickness;
- placing a flexible die seal upon the first die surface of the semiconductor die;
- and
- while pressing the die seal against the semiconductor die, applying mold material to at least a portion of the semiconductor die,
- wherein the die seal comprises a generally planar first seal surface comprising:
- a first area for covering the first die surface during said applying mold material, the first area having a plurality of edges, each edge of the first area corresponding to a corresponding edge of the first die surface;
- and
- a second area surrounding the first area, the second area comprising a plurality of elongated protrusions having a length oriented parallel to the first seal surface and to a corresponding edge of the first area, each protrusion having a generally flat portion for covering a portion of a corresponding one of the plurality of die faces during said applying mold material, wherein each protrusion of the plurality of elongated protrusions comprises a flap, and wherein a lower edge of the flap has a contour that controls an amount of its corresponding one of the plurality of die faces that is exposed to contact with the mold material used to encapsulate the semiconductor die.
5 more elements
A method for producing an electrical circuit, the method comprising:
- placing a semiconductor die in a mold tool, the semiconductor die comprising a first die surface, a second die surface generally parallel to the first die surface, and a plurality of die faces, each die face connecting an edge of the first die surface with a corresponding edge of the second die surface to define a die thickness;
- placing a flexible die seal upon the first die surface of the semiconductor die;
- and
- while pressing the die seal against the semiconductor die, applying mold material to at least a portion of the semiconductor die,
- wherein the die seal comprises a generally planar first seal surface comprising:
- an area for covering the first die surface during said applying mold material;
- and
- a plurality of elongated protrusions generally bounding the area, each having a length oriented parallel to the first seal surface and a generally flat portion for covering a portion of a corresponding one of the plurality of die faces during said applying mold material, wherein each protrusion of plurality of elongated protrusions comprises a flap, wherein a lower edge of the flap has a contour that controls an amount of its corresponding one of the plurality of die faces that is exposed to contact with the mold material used to encapsulate the semiconductor die, and wherein each protrusion maximally projects from the first seal surface at a midpoint of the length of the protrusion.
5 more elements
A method for producing an electrical circuit, the method comprising:
- placing a semiconductor die in a mold tool, the semiconductor die comprising a first die surface, a second die surface generally parallel to the first die surface, and a plurality of die faces, each die face connecting an edge of the first die surface with a corresponding edge of the second die surface to define a die thickness;
- placing a flexible die seal upon the first die surface of the semiconductor die;
- and
- while pressing the die seal against the semiconductor die, applying mold material to at least a portion of the semiconductor die,
- wherein the die seal comprises:
- a generally planar first seal surface comprising an area for covering the first die surface;
- and
- a curved seal wall connecting the first seal surface to a second seal surface,
- wherein an outline of the first seal surface in a planar view comprises a plurality of curves.
6 more elements
A method for producing an electrical circuit, the method comprising:
- placing a semiconductor die in a mold tool, the semiconductor die comprising a first die surface, a second die surface generally parallel to the first die surface, and a plurality of die faces, each die face connecting an edge of the first die surface with a corresponding edge of the second die surface to define a die thickness;
- placing a flexible die seal upon the first die surface of the semiconductor die;
- and
- while pressing the die seal against the semiconductor die, applying mold material to at least a portion of the semiconductor die,
- wherein the die seal comprises a generally planar first seal surface comprising:
- a first area for covering the first die surface during said applying mold material, the first area having a plurality of edges, each edge of the first area corresponding to a corresponding edge of the first die surface;
- and
- a second area surrounding the first area, the second area comprising a plurality of elongated protrusions having a length oriented parallel to the first seal surface and to a corresponding edge of the first area, each protrusion having a generally flat portion for covering a portion of a corresponding one of the plurality of die faces during said applying mold material, wherein each protrusion of the plurality of elongated protrusions comprises a flap, wherein a lower edge of the flap has a contour that controls an amount of its corresponding one of the plurality of die faces that is exposed to contact with the mold material used to encapsulate the semiconductor die, and wherein the maximum projection of each protrusion is at least 50% of the die thickness at a midpoint of the length of the protrusion.
5 more elements
A method for producing an electrical circuit, the method comprising:
- placing a semiconductor die in a mold tool, the semiconductor die comprising a first die surface, a second die surface generally parallel to the first die surface, and a plurality of die faces, each die face connecting an edge of the first die surface with a corresponding edge of the second die surface to define a die thickness;
- placing a flexible die seal upon the first die surface of the semiconductor die;
- and
- while pressing the die seal against the semiconductor die, applying mold material to at least a portion of the semiconductor die,
- wherein the die seal comprises a generally planar first seal surface comprising:
- an area for covering the first die surface during said applying mold material;
- and
- a plurality of elongated protrusions generally bounding the area, each having a length oriented parallel to the first seal surface and a generally flat portion for covering a portion of a corresponding one of the plurality of die faces during said applying mold material, wherein each protrusion of the plurality of elongated protrusions comprises a flap, wherein a lower edge of the flap has a contour that controls an amount of its corresponding one of the plurality of die faces that is exposed to contact with the mold material used to encapsulate the semiconductor die and maximally projects from the first seal surface at a midpoint of the length of the protrusion, and wherein the length of each protrusion is less than a length of a corresponding one of the plurality of die faces.
5 more elements
A method for producing an electrical circuit, the method comprising:
- placing a semiconductor die in a mold tool, the semiconductor die comprising a first die surface, a second die surface generally parallel to the first die surface, and a plurality of die faces, each die face connecting an edge of the first die surface with a corresponding edge of the second die surface to define a die thickness;
- placing a flexible die seal upon the first die surface of the semiconductor die;
- and
- while pressing the die seal against the semiconductor die, applying mold material to at least a portion of the semiconductor die,
- wherein the die seal comprises:
- a generally planar first seal surface comprising an area for covering the first die surface;
- and
- wherein an outline of the seal surface in a planar view is curved, proximate a portion of an area corresponding to a corner of the first die surface.
5 more elements
Dependencies are inferred from the claim text.