Nanolayer deposition process

A deposition method to deposit a conformal film in composition and thickness on a non-planar surface having at least one sidewall and a planar surface of a substrate, the conformal film comprised of a plurality of layers, the deposition method comprising:

• introducing a first plurality of precursors into a reaction chamber, the reaction chamber containing a substrate;
• depositing a first layer having at least one sidewall and a planar surface over the non-planar surface of the substrate along the at least one sidewall and the planar surface of the substrate from the first plurality of precursors on the substrate, the deposition being not self-limiting;
• purging the first plurality of precursors from the reaction chamber;
• plasma treating to modify the first layer along the at least one sidewall and the planar surface of the first layer with a second plurality of precursors, wherein the second plurality of precursors has a composition different from the first plurality of precursors;
• depositing during the plasma treating step at least one subsequent layer from the second plurality of precursors;
• and
• repeating depositing the first layer, plasma treating to modify the first layer, and depositing the at least one subsequent layer, wherein the plasma treating step is performed after each depositing the first layer step throughout the deposition of the film and reaches bottoms of the deposited first layers to completely modify the first layers and form a conformal film.