Thermally conductive printed circuit board bumpers

Apparatus, comprising:

• an electrical component;
• a printed circuit board to which the electrical component is mounted;
• a thermally conductive electronic device housing structure;
• and
• thermally conductive elastomeric structures interposed between the printed circuit board and the thermally conductive electronic device housing structure to conduct heat from the electrical component to the thermally conductive electronic device housing structure, wherein the thermally conductive elastomeric structures comprise at least one elastomeric member with a C-shaped cross section.

An electronic device, comprising:

• a printed circuit board that includes metal traces;
• an integrated circuit mounted on the printed circuit board that generates heat that is conducted to the metal traces;
• a thermally conductive housing structure;
• and
• thermally conductive elastomeric bumper structures that are coupled between the printed circuit board and the thermally conductive housing structure to conduct heat from the metal traces to the thermally conductive housing structure, wherein the thermally conductive housing structure comprises a metal housing wall with an inner surface, wherein the metal traces include ground plane traces, wherein the printed circuit board includes an edge surface coated with a metal layer that contacts at least one of the ground plane traces, and wherein the thermally conductive elastomeric bumper structures contact the metal layer and contact the inner surface of the metal housing wall.

Apparatus, comprising:

• an integrated circuit that generates heat;
• a printed circuit to which the integrated circuit is mounted;
• a metal electronic device housing structure;
• and
• a thermally conductive elastomeric member that physically contacts the printed circuit and that physically contacts the metal electronic device housing member, wherein the printed circuit has opposing upper and lower surfaces and has an edge surface that is perpendicular to the upper and lower surfaces, wherein the printed circuit includes metal traces coupled to a metal layer on the edge surface, and wherein the thermally conductive elastomeric member is configured to conduct heat from the metal layer of the edge surface to the metal electronic device housing structure to cool the electrical component.

Apparatus, comprising:

• an electrical component;
• a printed circuit board to which the electrical component is mounted;
• a thermally conductive electronic device housing structure;
• and
• thermally conductive elastomeric structures interposed between the printed circuit board and the thermally conductive electronic device housing structure, wherein the thermally conductive elastomeric structures are in contact with more than one surface of the printed circuit board.

Apparatus, comprising:

• an electrical component;
• a printed circuit board to which the electrical component is mounted;
• a thermally conductive electronic device housing structure;
• and
• thermally conductive elastomeric structures interposed between the printed circuit board and the thermally conductive electronic device housing structure, wherein the thermally conductive elastomeric structures are in contact with more than one surface of the thermally conductive electronic device housing structure.