Electronic device cooling with microjet impingement and method of assembly

A cooling system for an integrated circuit device, said cooling system comprising:

• a substrate having a surface with a wetting feature comprising:
• at least one of an array of spaced-apart nanoscale structures and an array of spaced-apart microscale structures formed on at least a portion of said surface;
• and
• a wettability coating covering at least a portion of said surface;
• a spacer coupled to said substrate adjacent said surface;
• an injector plate coupled to said spacer, said injector plate comprising:
• at least one microjet defined therethrough;
• and
• at least one exit hole defined therethrough, wherein said at least one exit hole is adjacent said microjet;
• a flow channel plate coupled to said injector plate, said flow channel plate including at least one inlet channel coupled in flow communication with said at least one microjet;
• and
• a manifold baseplate coupled to said flow channel plate, said manifold baseplate including an inlet reservoir coupled in flow communication with said at least one inlet channel.

A method comprising:

• forming a wetting feature on a surface of a substrate of a die, including:
• forming at least one of an array of spaced-apart nanoscale structures and an array of spaced-apart microscale structures on at least a portion of the surface;
• and
• applying a wettability coating to at least a portion of the surface;
• coupling a spacer to the die adjacent the surface;
• and
• coupling an injector plate to the spacer, wherein the injector plate includes at least one microjet defined through the injector plate and at least one exit hole defined through the injector plate, wherein the at least one exit hole is positioned adjacent the at least one microjet.