Trench schottky devices

Abstract

During fabrication of a semiconductor device, a width of semiconductor mesas between isolation trenches in the semiconductor device is varied in different regions. In particular, the width of the mesas is smaller in a termination region of the semiconductor device than in a cell or active region. When an oxide layer is subsequently grown, the semiconductor mesas between the trenches in the termination region are at least partially consumed so that the semiconductor mesas in the cell region and the termination region have different heights. Therefore, a contact photomask is not needed to isolate the semiconductor mesas in the termination region. Furthermore, after a planarization operation (such as chemical mechanical polishing), the semiconductor device may have a planar top surface than if contact holes are created. This may allow the metal layer deposited on top of the cell region and the termination region to be flat.

Dependencies are inferred from the claim text.