Nonvolatile semiconductor memory device including silicon germanium semiconductor layer
AssigneeKabushiki Kaisha Toshiba
InventorsJun Fujiki, Yoshiaki Fukuzumi, Hideaki Aochi
Life of this patent
Estimating the term…
Loading patent…
AssigneeKabushiki Kaisha Toshiba
InventorsJun Fujiki, Yoshiaki Fukuzumi, Hideaki Aochi
Estimating the term…
According to one embodiment, a nonvolatile semiconductor memory device includes a stacked body, a second insulating layer, a select gate, a memory hole, a memory film, a channel body, a first semiconductor layer, and a second semiconductor layer. The select gate is provided on the second insulating layer. The memory film is provided on an inner wall of the memory hole. The channel body is provided inside the memory film. The first semiconductor layer is provided on an upper surface of the channel body. The second semiconductor layer is provided on the first semiconductor layer. The first semiconductor layer contains silicon germanium. The second semiconductor layer contains silicon germanium doped with a first impurity. A boundary between the first semiconductor layer and the second semiconductor layer is provided above a position of an upper end of the select gate.
A nonvolatile semiconductor memory device comprising:
A nonvolatile semiconductor memory device comprising:
Dependencies are inferred from the claim text.