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US 8,912,051 B1Granted
Method for controlling molding compound geometry around a semiconductor die
AssigneeAmkor Technology, Inc.
InventorsAhmer Syed, Miguel Jimarez, Jeff Watson
Life of this patent
Estimating the term…
Abstract
A novel die seal design, and method for utilization thereof, controls contact of a mold material with the surfaces of a semiconductor die during application, reducing stresses due to a mismatch of the coefficient of thermal expansion of the mold material and the semiconductor die, thereby reducing cracking of the semiconductor die, resulting in increased yields and lower costs, and permits reuse of elements of a mold tool over a range of die sizes.
Claims20
A method for producing an electrical circuit, the method comprising:
- placing a semiconductor die in a mold tool, the semiconductor die comprising a first die surface, a second die surface generally parallel to the first die surface, and a plurality of die faces, each die face connecting an edge of the first die surface with a corresponding edge of the second die surface to define a die thickness;
- placing a flexible die seal upon the first die surface;
- and
- while pressing the die seal against an entirety of the first die surface of the semiconductor die, applying mold material to at least a portion of the semiconductor die;
- wherein the die seal comprises:
- a first seal surface having a generally planar first area for covering the entirety of the first die surface during said applying mold material,
- the first area having a plurality of edges forming a perimeter of the first area, each of the plurality of edges of the first area extending beyond a corresponding edge of the first die surface such that the first area of the first seal surface is larger than the first die surface,
- the first seal surface also having a generally planar second area surrounding the first area, wherein the first area and second area are not in a same plane;
- and
- a second seal surface for securing the die seal to an element of the mold tool.
7 more elements
A method for producing an electrical circuit, the method comprising:
- placing a first seal surface of a flexible die seal upon a first die surface of a semiconductor die, the semiconductor die comprising a first die surface, a second die surface generally parallel to the first die surface, and a plurality of die faces, each die face connecting an edge of the first die surface with a corresponding edge of the second die surface;
- and
- while pressing the die seal against an entirety of the first die surface of the semiconductor die, applying mold material to at least a portion of the semiconductor die, such that pressure applied to the die seal during said applying mold material is sufficient to cause the first seal surface of the die seal to form a bulge that borders each edge of the first die surface;
- wherein the first seal surface comprises:
- a generally planar first area for covering the entirety of the first die surface during said applying mold material, the first area having a plurality of edges forming a perimeter of the first area, each of the plurality of edges of the first area extending beyond a corresponding edge of the first die surface such that the first area of the first seal surface is larger than the first die surface;
- and
- a generally planar second area surrounding the first area, wherein the first area and second area are not in a same plane.
4 more elements
A system for producing an electrical circuit, the system comprising:
- a mold tool for receiving a semiconductor die, the semiconductor die comprising a first die surface, a second die surface generally parallel to the first die surface, and a plurality of die faces, each die face connecting an edge of the first die surface with a corresponding edge of the second die surface to define a die thickness;
- a flexible die seal that is operable to press against an entirety of the first die surface to define a cavity that enables application of a mold material to at least a portion of the semiconductor die;
- wherein the die seal comprises:
- a first seal surface having a generally planar first area for covering an entirety of the first die surface during said application of mold material,
- the first area having a plurality of edges forming a perimeter of the first area, each of the plurality of edges of the first area having a portion extending beyond a corresponding edge of the first die surface such that the first area of the first seal surface is larger than the first die surface,
- the first seal surface also having a generally planar second area surrounding the first area, wherein the first area and the second area are not in a same plane;
- and
- a second seal surface for securing the die seal to an element of the mold tool.
5 more elements
Dependencies are inferred from the claim text.