Aqueous floor polishing composition
AssigneeAdeka Corporation
InventorsYuji Yamazaki, Masashi Harada
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Abstract
The present invention is the aqueous floor polishing composition which contains the polyoxyalkylene diester compound represented by the following general formula (1) and does not contain the phosphorus-containing plasticizer. R1 and R2 represent each independently alkyl groups having 1 to 24 carbon atoms, m represents an integer from 2 to 4, n represents a number from 2 to 40. The aqueous floor polishing composition of the present invention does not contain the phosphorus-containing plasticizer. Therefore, it does not affect the environment negatively, in spite of having excellent leveling properties, lustering properties and heel mark resistance properties.
Claims12
An aqueous floor polishing composition comprising a film forming component and a polyoxyalkylenediester compound of formula (1), which does not contain phosphorus containing plasticizer;
- wherein both of R1 and R2 represent 2-ethylhexyl, m represents an integer from 2 to 4 and n represents a number from 2 to 40.
Dependencies are inferred from the claim text.