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US 8,897,014 B2Granted
Mechanical layout for half-bridge power module that is optimized for low inductance
AssigneeGeneral Electric Company
InventorsRobert Gregory Wagoner, Allen Michael Ritter, Mark Eugene Shepard
Life of this patent
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Abstract
Disclosed is a mechanical layout for a half-bride power module that is optimized for low inductance. In one embodiment, a first power module and a second power module are mounted on each side of a heat sink. An inductance cancelling bus bar is wrapped around the heat sink, the first power module and the second power module in a loop.
Claims20
A half-bridge power module, comprising:
- a heat sink;
- a first power module mounted on one side of the heat sink;
- a second power module mounted on another side of the heat sink opposite the side that the first power module mounts thereto;
- and
- an inductance cancelling bus bar wrapped around the heat sink, the first power module and the second power module in a loop.
2 more elements
A power module having a half-bridge configuration, comprising:
- a heat sink;
- a first IGBT power module mounted on one surface of the heat sink in a first plane that is co-planar to one surface of the heat sink;
- a second IGBT power module mounted on another surface of the heat sink in a second plane that is co-planar to the another surface of the heat sink, wherein the first plane and the second plane are separated by a thickness of the heat sink;
- a capacitor bank connected to both the first IGBT power module and the second IGBT power module;
- and
- an inductance cancelling bus bar wrapped around the heat sink, the first IGBT power module and the second power IGBT module in a loop.
3 more elements
Dependencies are inferred from the claim text.