Heat dissipation system for power module
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsYoung Hoon Kwak, Jong Man Kim, Young Ho Sohn
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Abstract
Disclosed herein is a heat dissipation system for a power module, the heat dissipation system including: first and second heat dissipation plates spaced apart from each other while facing each other, to form a cooling medium flow passage; first and second inflow lines extended to the cooling medium flow passage of the first and second heat dissipation plates, to transfer cooling media flowing therein at different flow rates or different fluxes to the cooling medium flow passage; and first and second inlets respectively connected with the first and second inflow lines to allow the cooling media to flow therein.
Claims18
A heat dissipation system for a power module, the heat dissipation system comprising:
- first and second heat dissipation plates spaced apart from each other while facing each other, to form a cooling medium flow passage;
- first and second inflow lines extended to the cooling medium flow passage of the first and second heat dissipation plates, to transfer cooling media flowing therein at different flow rates or different fluxes to the cooling medium flow passage;
- and
- first and second inlets respectively connected with the first and second inflow lines to allow the cooling media to flow therein.
A heat dissipation system for a power module comprising a plurality of inflow lines and supplying cooling media to a plurality of inflow lines at different flow rates or fluxes.
Dependencies are inferred from the claim text.