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US 8,895,210 B2Granted
Method for fabricating pellicle, photo mask, and semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorsMasato Suzuki, Tetsuro Nakasugi
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Abstract
An aspect of the present embodiment, there is provided a method for fabricating a pellicle, including acquiring a shape of a pellicle frame, deciding a thickness distribution of an adhesive to be coated on the pellicle frame on a basis of the acquired shape of the pellicle frame, and coating the adhesive on the pellicle frame based on the decision of the thickness distribution.
Claims8
A method for fabricating a pellicle, comprising:
- acquiring a shape of a pellicle frame;
- deciding a thickness distribution of an adhesive to be coated on the pellicle frame on a basis of the acquired shape of the pellicle frame;
- and
- coating the adhesive on the pellicle frame on a basis of the decision of the thickness distribution;
- wherein the thickness distribution of the adhesive is decided to optimize a shape of a photo mask on which the pellicle frame is attached in a state that the photo mask is chucked on a photo mask chuck of an exposure apparatus,
- the deciding the thickness distribution of the adhesive includes estimating a thickness of the adhesive to be coated on the pellicle frame, anticipating the shape of the photo mask when the photo mask is coated with adhesive having the estimated thickness distribution, deciding whether or not the anticipated shape of the photo mask is satisfied with a prescribed condition, and deciding the anticipated thickness distribution of the adhesive as a final thickness distribution when the anticipated shape of the photo mask is decided to be satisfied with the prescribed condition.
3 more elements
Dependencies are inferred from the claim text.