Substrate processing apparatus and substrate processing method
AssigneeSCREEN Semiconductor Solutions Co., Ltd.
InventorsTadashi Miyagi, Masashi Kanaoka, Kazuhito Shigemori, Shuichi Yasuda, Masakazu Sanada
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AssigneeSCREEN Semiconductor Solutions Co., Ltd.
InventorsTadashi Miyagi, Masashi Kanaoka, Kazuhito Shigemori, Shuichi Yasuda, Masakazu Sanada
Estimating the term…
After a substrate is cleaned, a liquid layer of a rinse liquid is formed so as to cover one surface of the substrate. Then, a liquid supply nozzle moves outward from above the center of the substrate. The liquid supply nozzle is stopped once at the time point where it moves by a predetermined distance from above the center of the substrate. In this time period, the liquid layer is divided within a thin layer region by a centrifugal force, so that a drying core is formed at the center of the liquid layer. Thereafter, the liquid supply nozzle moves outward again, so that a drying region where no rinse liquid exists expands on the substrate with the drying core as its starting point.
A substrate processing method for processing a substrate in a substrate processing apparatus that is arranged adjacent to an exposure device and includes a processing section and an interface, the substrate processing method comprising the steps of:
A substrate processing method for processing a substrate in a substrate processing apparatus that is arranged adjacent to an exposure device and includes a processing section and an interface, the substrate processing method comprising the steps of:
Dependencies are inferred from the claim text.