Back to results
US 8,803,295 B2Granted
Circuit structure and manufacturing method thereof
AssigneeSubtron Technology Co., Ltd.
InventorChing-Sheng Chen
Life of this patent
Estimating the term…
Abstract
A manufacturing method of a circuit structure is provided. A metal layer having an upper surface is provided. A surface passivation layer is formed on the metal layer. The surface passivation layer exposes a portion of the upper surface of the metal layer, and a material of the metal layer is different from a material of the surface passivation layer. A covering layer is formed on the surface passivation layer, and the covering layer covers the surface passivation layer.
Claims7
A circuit structure comprising:
- a metal layer having an upper surface;
- a surface passivation layer located on the upper surface of the metal layer, the surface passivation layer exposing a portion of the upper surface of the metal layer, a material of the metal layer being different from a material of the surface passivation layer;
- and
- a covering layer located on the surface passivation layer, the covering layer covering the surface passivation layer, wherein a material of the covering layer comprises an organic material, and the organic material comprises mercaptan nano-polymer or hydroxypropyl-beta-cyclodextrin.
1 more element
Dependencies are inferred from the claim text.