Semiconductor device

A semiconductor device comprising:

• a semiconductor substrate;
• a field insulating film provided on the semiconductor substrate;
• a fuse provided on the field insulating film, the fuse having a fuse trimming laser irradiation portion configured to be subjected to laser trimming and fuse terminals provided on both sides of the fuse trimming laser irradiation portion;
• an intermediate insulating film covering the fuse;
• a first TEOS layer provided on the intermediate insulating film;
• an SOG layer for planarizing the first TEOS layer;
• a second TEOS layer provided on the SOG layer and on the first TEOS layer;
• a protective film provided on the second TEOS layer;
• an opening portion provided above the fuse trimming laser irradiation portion in a region from the protective film to the first TEOS layer;
• and
• a seal ring provided on the intermediate insulating film so as to surround the opening portion, the seal ring being disposed over the fuse so as to overlap each of the fuse terminals in plan view.

A semiconductor device comprising:

• a semiconductor substrate;
• a field insulating film provided on the semiconductor substrate;
• a fuse provided on the field insulating film, the fuse having a fuse trimming laser irradiation portion configured to be subjected to laser trimming and fuse terminals provided on both sides of the fuse trimming laser irradiation portion, each of the fuse terminals having a wider width that that of the fuse trimming laser irradiation portion;
• an intermediate insulating film covering the fuse;
• a first TEOS layer provided on the intermediate insulating film;
• an SOG layer for planarizing the first TEOS layer;
• a second TEOS layer provided on the SOG layer and on the first TEOS layer;
• a protective film provided on the second TEOS layer;
• an opening portion provided above the fuse trimming laser irradiation portion in a region from the protective film to the first TEOS layer;
• and
• a seal ring provided on the intermediate insulating film so as to surround the opening portion and extend over each of the fuse terminals, a length along which the seal ring extends over each of the fuse terminals being greater than the width of the fuse trimming laser irradiation portion.