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US 8,803,166 B2Granted
Structure of AC light-emitting diode dies
AssigneeEpistar Corporation
InventorsMing-Te Lin, Fei-Chang Hwang, Chia-Tai Kuo
Life of this patent
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Abstract
An arrangement of light emitting diodes including a first micro-die, a second micro-die, a first bridge, a second bridge and a substrate supporting the first micro-die and the second micro die. The first micro-die includes a first edge having a first end and a second end, a second edge opposite and not parallel to the first edge, a first connecting portion near the first end, and a second connecting portion near the second end.
Claims13
An arrangement of light emitting diodes, comprising:
- a substrate;
- and
- four adjoining light-emitting units forming a light-emitting array on said substrate, each unit comprising at least one micro-die, each micro-die comprising:
- a lower semiconductor layer of first conductivity on said substrate;
- an upper semiconductor layer of second conductivity opposite to the first conductivity on said lower semiconductor layer;
- a first connecting portion disposed on the lower semiconductor layer;
- and
- a second connecting portion disposed on the upper semiconductor layer,
- wherein the first connecting portion and the second connecting portion are respectively located near different sides of the micro-die, and
- wherein the four adjoining light-emitting units comprise a first group of the connecting portions comprising four connecting portions disposed substantially at a center of the light-emitting array, and a second group of the connecting portions comprising another four connecting portions disposed substantially at the periphery of the light-emitting array.
7 more elements
An arrangement of light emitting diodes, comprising:
- a first micro-die comprising a first edge having a first end and a second end, a second edge opposite and not parallel to the first edge, a first connecting portion near the first end, and a second connecting portion near the second end;
- a second micro-die
- a first bridge covering the first connecting portion, and electrically connecting the first micro-die with the second micro-die;
- a second bridge covering the second connecting portion, and electrically connecting the first micro-die with the second micro-die;
- and
- a substrate supporting the first micro-die and the second micro die.
3 more elements
Dependencies are inferred from the claim text.