Stable, concentratable silicon wafer polishing composition and related methods
AssigneeRohm and Haas Electronic Materials CMP Holdings, Inc.
InventorsNaresh Kumar Penta, Lee Melbourne Cook
Life of this patent
Estimating the term…
Abstract
A stable, concentratable silicon wafer polishing composition for polishing silicon wafers is provided, containing: water; an abrasive; a cation according to formula (I); piperazine or a piperazine derivative according to formula (II); and, optionally, a pH adjusting agent; wherein the polishing composition exhibits a silicon removal rate of at least 300 nm/min. Also provided are methods of making and using the stabilized, concentratable chemical mechanical polishing composition.
Claims10
A stabilized, concentratable chemical mechanical polishing composition for polishing a silicon wafer, comprising:
- water;
- an abrasive;
- a cation according to formula (I):
- wherein R1, R2, R3, R4 are independently selected from the group consisting of a hydrogen and a C1-10 alkyl group, a C1-10 aryl group, a C1-10 arylalkyl group and a C1-10 alkylaryl group;
- and,
- piperazine or a piperazine derivative according to formula (II)
- wherein R5 is selected from the group consisting of a hydrogen, a C1-10 alkyl group, a C1-10 aryl group, a C1-10 arylalkyl group and a C1-10 alkylaryl group;
- and,
- optionally, a pH adjusting agent;
- wherein the polishing composition exhibits a silicon removal rate of at least 300 nm/min.
Dependencies are inferred from the claim text.