Device and process for wet treating a peripheral area of a wafer-shaped article

Process for treating a peripheral area of a wafer-shaped article comprising:

• holding the wafer-shaped article at its edge and rotating the wafer-shaped article about an axis A with holding means, wherein the holding means comprise rollers for driving the wafer-shaped article at its edge,
• supplying a first liquid towards a first section of the peripheral area with a first liquid treatment unit, wherein the supplying of the first liquid comprises:
• wetting the first section of the peripheral area with the first liquid, so that the section of the peripheral area moves along the peripheral area of the wafer-shaped article as the wafer-shaped article rotates,
• removing most of the first liquid;
• supplying a second liquid towards a second section of the peripheral area with a second liquid treatment unit, wherein the supplying of the second liquid comprises:
• wetting the second section of the peripheral area with the second liquid, so that the section of the peripheral area moves along the peripheral area of the wafer-shaped article as the wafer-shaped article rotates,
• supplying gas from a gas treatment section positioned circumferentially adjacent to the second liquid treatment unit with respect to a circle centered on and perpendicular to axis A, towards the wetted second section of the peripheral area, for removing residues of the second liquid from the peripheral area, and
• discharging supplied gas and removed liquid;
• wherein the first and second liquids are different from one another and are dispensed simultaneously onto the wafer-shaped article without substantial mixing of the first and second liquids.