Electronic component and producing method thereof

A method for producing an electronic component, the electronic component including a component body and an external electrode formed on a particular region in a surface of the component body, the electronic component producing method comprising:

• a step of preparing the component body in which a bump is provided in a position, the particular region where the external electrode should be formed being partitioned at the position;
• and
• a plating step of directly plating the surface of the component body to deposit a plating film in the particular region, the plating film constituting the external electrode;
• wherein
• the plating step includes a step of growing the plating film toward the bump and a step of substantially stopping or delaying the growth of the plating film in the bump.