Methods and arrangement for plasma dechuck optimization based on coupling of plasma signaling to substrate position and potential

An article of manufacture comprising a non-transitory program storage medium having computer readable code embodied therein, said computer readable code being configured for optimizing a dechuck sequence, in which said dechuck sequence includes mechanically removing a substrate from a lower electrode in a processing chamber of a plasma processing system, comprising:

• code for turning off a clamp voltage;
• code for supplying inert gas to a backside of the substrate;
• code for performing an initial analysis, wherein said initial analysis includes
• code for analyzing a first set of electrical characteristic data of a plasma sampled before raising lifter pins, wherein said plasma is formed over said substrate during said dechuck sequence, and wherein said first set of characteristic data is independent of force on the lifter pins,
• code for comparing said first set of electrical characteristic data against a set of electrical characteristic threshold values, and
• code for turning of said inert gas provided in said plasma processing chamber if said first set of electrical characteristic data traverses, by at least one of exceeding, falling below or remaining with a range of, said set of electrical characteristic threshold values;
• code for raising the lifter pins from said lower electrode to move said substrate in an upward direction, wherein said lifter pins are not raised to a maximum height;
• and
• code for performing a mechanical and electrical analysis after raising the lifter pins, wherein said mechanical and electrical analysis includes
• code for analyzing a first set of mechanical data, wherein said set of mechanical data includes the amount of force exerted by said lifter pins,
• code for analyzing a second set of electrical characteristic data,
• code for comparing said first set of mechanical data to a set of mechanical threshold values and said second set of electrical characteristic data to said set of electrical characteristic threshold values, and
• code for removing said substrate from said lower electrode if said first set of mechanical data traverses, by at least one of exceeding, falling below or remaining with a range of, said set of mechanical threshold values and said second set of electrical characteristic data traverses said set of electrical characteristic threshold values, since said substrate-released event has occurred.