Electronic part recognition apparatus and chip mounter having the same
AssigneeSamsung Techwin Co., Ltd.
InventorJae-Hyun Park
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AssigneeSamsung Techwin Co., Ltd.
InventorJae-Hyun Park
Estimating the term…
A method of operating a chip mounter is provided, comprising: preparing an electronic part on a part supply unit and a printed circuit board on a main body; gripping the electronic part using a part conveyor unit to move the electronic part along a part moving path on the part supply unit and the main body; photographing the electronic part when the electronic part is located at a part recognition region within the part moving path without stoppage and during the movement of the electronic part; transmitting a photographed image of the electronic part to a controller using the image processing unit; comparing the photographed image with a reference image using the controller; and displaying the photographed image to the exterior using the controller; wherein the part recognition region is set by at least one coordinate in the controller to be located on a light source of the processing unit.
A method of operating a chip mounter, the method comprising:
Dependencies are inferred from the claim text.
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Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling…
Printed circuits
About 2 years 6 months of term left · ends 21 Apr 2029 (estimated)
The present invention relates to a chip mounter. Various embodiments of the invention relate to an electronic part recognition apparatus and a chip mounter having the same that are capable of photographing images of an electronic part while the electronic part is suctioned by a nozzle installed in a head, without stoppage of the head as it moves to a mounting position.
In general, a chip mounter is an apparatus for mounting electronic parts such as semiconductor packages on a printed circuit board (PCB).
In recent times, substrates have become dense and highly functional, and therefore, individual integrated circuit parts have also become highly functional. As a result, the number of output pins mounted on the substrate is increased and intervals between the output pins are reduced.
The foregoing and other objects, features and advantages of various embodiments of the invention will be apparent from the more particular description of an exemplary embodiment of the invention illustrated in the accompanying drawing. The drawing is not necessarily to scale, emphasis instead being placed upon illustrating the principles of the invention.
FIG. 1 is a perspective view of a chip mounter having an electronic part recognition apparatus in accordance with an exemplary embodiment of the present invention;
FIG. 2 is a view showing photographing of an electronic part disposed on a part recognition region of FIG. 1;
The present invention will now be described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments of the invention are shown.
Referring to FIG. 1, the chip mounter in accordance with an exemplary embodiment of the present invention includes a main body 100. The main body 100 has a mounting position P2 of an electronic part 50 mounted on a printed circuit board P. Here, the printed circuit board P may be moved to the mounting position P2 of the main body 100 by a conveyor apparatus (now shown).
In addition, a part supply unit 200 is installed at the main body 100 to supply the electronic part 50. The part supply unit 200 may be a tape feeder, and can sequentially supply a certain number of electronic parts 50 to a pick-up position P1.