Electronic device covered by multiple layers and method for manufacturing electronic device

An electronic device comprising:

• a substrate;
• an MEMS structure formed above the substrate;
• and
• a covering structure defining a cavity in which the MEMS structure is arranged, wherein
• the covering structure has
• a first covering layer covering from above the cavity and having a through-hole in communication with the cavity, and
• a second covering layer formed above the first covering layer and closing the through-hole,
• the first covering layer has, in a plan view from a thickness direction of the substrate,
• a first region located above at least the MEMS structure, and
• a second region located around the first region,
• the first covering layer is thinner in the first region than in the second region,
• a distance between the substrate and the first covering layer in the first region is longer than a distance between the substrate and the first covering layer in the second region,
• the through-hole is formed in the first region between the MEMS structure and the second region in the plan view,
• the second covering layer is formed above the first covering layer located above the MEMS structure, and
• a first thickness of the second covering layer that is formed in and above the through-hole is the same as a second thickness that is obtained by combining thicknesses of the first and second covering layers located above the MEMS structure.